Korean Firms Advance AI Chip Packaging Alternatives to TSMC
Samsung Electro-Mechanics and LG Innotek are developing advanced substrate technologies, including Intel’s EMIB, to prepare for evolving AI semiconductor packaging demands.
Korean Firms Eye Next-Generation AI Packaging
Korean substrate manufacturers Samsung Electro-Mechanics and LG Innotek are enhancing their capabilities in advanced semiconductor packaging. This move comes as Taiwan Semiconductor Manufacturing Co.'s (TSMC) CoWoS-L (chip-on-wafer-on-substrate-L) technology currently dominates the AI semiconductor packaging market.
Market research firm TrendForce forecasts that CoWoS-L will remain the primary AI packaging solution through at least 2028, but the industry is already exploring diverse solutions for future needs.
Intel's EMIB Technology Gains Attention
Among the alternatives being developed by Korean firms is Intel's embedded multi-die interconnect bridge (EMIB) technology. Unlike traditional methods relying on large silicon interposers, EMIB connects chips using small silicon bridges embedded within the substrate. This approach offers enhanced flexibility for complex package designs.
Intel has also introduced EMIB-T, an improved version designed for high-performance applications like AI semiconductors, to boost power delivery efficiency.
Strategic Diversification of Substrate Technologies
The efforts by Samsung Electro-Mechanics and LG Innotek are not aimed at immediately displacing TSMC's leadership. Instead, they represent a strategic preparation for a market where multiple packaging architectures may coexist. Samsung Electro-Mechanics is developing 2.1D and 2.5D packaging substrate technologies, alongside future glass substrates.
LG Innotek is expanding its focus on high-end FC-BGA (flip-chip ball grid array) substrates, specifically targeting AI servers and data centres.
Adapting to Evolving AI Chip Demands
As AI accelerators grow in size and complexity, package substrates must support larger areas, higher layer counts, and intricate circuit designs. This presents challenges in achieving fine circuit formation, layer accuracy, and warpage control.
For Korean companies, investing in diverse packaging technologies ensures they can meet varied customer requirements and chip architectures. This strategic positioning allows them to capture future growth in the rapidly evolving global AI semiconductor supply chain, particularly as demand for advanced AI infrastructure expands across Asia.
This article is journalism, not investment advice; consult a licensed professional before making financial decisions. Market data is indicative, may be delayed, and should be verified with your broker or exchange before use.
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